Water vapor annealing technique on diamond surfaces for next-generation power devices

The existing surface termination technique using hydrogen to stabilize the diamond's structure for application in electronic power devices results in two-dimensional hole gas layers (2DHG). Attempting to remove these layers using oxygen-termination roughens the diamond surface and leads to degradation of the device performance. To overcome this, researchers removed 2DHG from diamond using water vapor annealing and maintained an atomically flat surface.

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